U.S. Department of Defense to Expand Manufacturing of Printed Circuit Board Assemblies for Hypersonic Weapons

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Media Credit:  Canva-SweetBunFactory, Getty Images
Automatic pick-and-place machine quickly installs components on generic circuit board (source: Canva).

April 4, 2024 | Originally published by Department of Defense (DoD) on March 8, 2024

The U.S. Department of Defense announced an award of $11.7 million via the Defense Production Act Investment (DPAI) Program to Ensign-Bickford Aerospace & Defense (EBAD) that will provide additional printed circuit board assembly (PCBA) production capacity at their Simsbury, CT location. EBAD will increase existing capacity and manufacturing processes to reduce cost and accelerate PCBA production.

“This effort is a key component of the DoD’s strategy to accelerate the development and fielding of hypersonic systems and deliver cutting-edge capabilities to our armed forces,” said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy. “This award also represents another investment in domestic manufacturing in accordance with the National Defense Industrial Strategy to help build a modernized defense industrial ecosystem.”

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