An inquirer requested access to a DSIAC referenced article, “Circuit Card Assembly Heat Sinks Embedded with Oscillating Heat Pipes,” and its references that had been previously published but no longer available through the original URL. DSIAC contacted the publishing organization to gain access to the specified article and then compiled a list of related sources from the publisher’s website, DTIC, and DSIAC journal articles. An update to the original inquiry was later done by adding research from the U.S. Air Force Research Laboratory Space Vehicles Directorate’s Thermal Systems group on oscillating heat pipes to cool next-generation chips/processors.
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