Using Shape Memory Alloys as an Intermediate for Materials With Dissimilar Coefficients of Thermal Expansion

https://technology.nasa.gov/t2media/tops/img/LAR-TOPS-163/Front%20-%20LAR-18335.jpg
NASA.gov photo, NASA photo of shape memory polymer bonding, https://technology.nasa.gov/patent/LAR-TOPS-163

Posted on June 10, 2020 | Completed on June 4, 2020 | By: Richard Piner, Doyle T. Motes III

Can the high-strain recovery and temperature memory aspects of shape memory alloys make them useful for developing a coupling between the dissimilar materials of high-temperature materials?

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